Memory device

ABSTRACT

A method and system for transferring information within a computer system is provided. The system includes a memory device that has a lower power mode in which data transfer circuitry is not driven by a clock signal, and a higher power mode in which data transfer circuitry is driven by a clock signal. The system further includes a memory controller that sends control signals to the memory device to initiate a data transfer transaction. The memory device receives the control signals asynchronously, and assumes the second mode in response to one of the control signals. While the memory device is in the second mode, the memory controller sends a control signal to identify a particular clock cycle. The memory device synchronously transfers the data. The memory device determines when to begin the data transfer based on the identified clock cycle and the type of data transfer that has been specified.

PRIORITY DATA

This is a continuation of U.S. patent application Ser. No. 11/123,931filed on May 6, 2005, now pending, which is a continuation of U.S.patent application Ser. No. 10/288,045 filed on Nov. 5, 2002, now U.S.Pat. No. 7,085,906, which is a continuation of U.S. patent applicationSer. No. 09/718,908 filed on Nov. 21, 2000, now U.S. Pat. No. 6,532,522,which is a continuation of U.S. patent application Ser. No. 08/648,300filed on May 7, 1996, now U.S. Pat. No. 6,209,071.

FIELD OF THE INVENTION

The present invention relates to digital storage devices, and morespecifically, to dynamic random access memory.

BACKGROUND OF THE INVENTION

Improvements in fabrication technology have resulted in dynamic randomaccess memories (DRAMs) with increased density, faster performance, andhigher operating frequencies. Because overall memory bandwidthrequirements are rising and the number of DRAMs in a system is falling,the ability to quickly transport data to and from each DRAM has becomeincreasingly important.

Asynchronous DRAMs

In conventional memory systems, the communication between a memorycontroller and DRAMs is performed through asynchronous communications.For example, the memory controller uses control signals to indicate tothe DRAM when requests for data transactions are sent. The datatransfers themselves are also performed asynchronously. To meetincreased speed requirements, various enhanced asynchronous memorysystems have been developed. One such system is the Extended Data Out(EDO) DRAM memory system.

FIG. 1 is a block diagram illustrating a typical EDO DRAM system 100. Inthe EDO DRAM system 100, data transfers are performed asynchronously inresponse to control signals and addresses sent from pin buffers 116 of amemory controller to pin buffers 118 of the EDO DRAM over a plurality oflines 120, 122, 124, 134 and 136. Specifically, lines 122 carry anaddress that is stored in latches 112 and 114. Line 120 carries a rowaddress strobe ( RAS) that controls when the address stored in latch 112is sent to row decoder 106. Line 134 carries an output enable signalthat controls data output of the DRAM. Line 136 carries a write enablesignal that controls timing chains 108 and the direction of data flow onthe bi-directional data bus 126.

Upon receiving an address, row decoder 106 loads data that correspondsto the address from a memory array 110 in memory core 102 into a senseamplifier array 130. Line 124 carries a column address strobe ( CAS)that controls when the address stored in latch 114 is sent to columndecoder 104. For a read operation, the column decoder 104 causes thedata that is stored in the columns of the sense amplifier array 130 thatcorrespond to the address received by column decoder 104 to betransferred through column I/O circuits 132. The data passes through thecolumn I/O circuits 132 to the memory controller over a data bus 126.

Alternately, an EDO DRAM may use address transition detect circuitry toinitiate the retrieval of data from the memory core, rather than the CASsignal. Address transition detect circuitry is circuitry that monitorsthe address bus to detect transitions in the data that is being sent onthe address bus. When a transition is detected, the EDO DRAM restartsthe timing chains causing data corresponding to a new address to fallout of the column I/O circuits 132.

The communication between the EDO DRAM and the memory controller isasynchronous. Thus, the EDO DRAM is not driven by an external clock.Rather, timing chains 108 that are activated by the RAS and CAS controlsignals are used to control the timing of the data transfer. Because thecore 102 is not driven unless activated by the RAS and CAS controlsignals, the core 102 does not consume energy unless a data transferoperation is taking place. Therefore, the EDO DRAM consumes less powerthan alternative architectures in which the interface is clocked evenwhen no memory operation is being performed.

FIG. 2 is a timing diagram for a read operation in EDO system 100. Attime T0 the memory controller places on lines 122 an address thatindicates the bank and row from which data is to be read. At time T1 theRAS signal goes LOW causing the address to be sent from latch 112 to rowdecoder 106. In response, row decoder 106 causes the appropriate row ofdata to be transferred from memory array 110 to sense amplifier array130.

At time T2 the memory controller places on lines 122 the address of thecolumn from which data is to be read. At time T3 the CAS signal goes LOWcausing the address to be sent from latch 114 to column decoder 104. Inresponse, column decoder 104 sends through column I/O circuits 132 datafrom the selected column of the row stored in sense amplifier array 130.Assuming that WE is HIGH and OE is LOW, the data will appear on data bus126. The data on the data bus 126 takes some time to stabilize. Toensure an accurate reading, the memory controller does not read the datafrom the data bus until time T4.

The delay between the time at which the RAS signal goes LOW to initiatea read operation and the time at which the data may be read from thedata bus 126 is identified as t_(RAC). The delay between the time atwhich the CAS signal goes LOW for a read operation and the time at whichthe data may be read from the data bus 126 is identified as t_(CAC). Thedelay between the time at which the column address is placed on theaddress bus and the time at which the data may be read from the data bus126 is identified as t_(CAA). In a typical EDO DRAM, exemplary times aret_(CAC)=15 ns and t_(CAA)=30 ns.

In one variation, the memory controller is allowed to have columnaddress flow through. The memory controller therefore has until T3 (thefall of CAS), rather than until T2 (the transmission of the columnaddress), to decide whether to perform a given transaction. In theexemplary times above, the memory controller would have 15 ns more timeto decide whether to perform a given transaction.

Synchronous DRAMs

DRAMs built with an asynchronous RAS/CAS interface have difficultymeeting the high memory bandwidth demands of many current computersystems. As a result, synchronous interface standards have beenproposed. These alternative interface standards include SynchronousDRAMs (SDRAMs). In contrast to the asynchronous interface of EDO DRAMS,SDRAM systems use a clock to synchronize the communication between thememory controller and the SDRAMs. Timing communication with a clockallows data to be placed on the DRAM output with more precise timing. Inaddition, the clock signal can be used for internal pipelining. Thesecharacteristics of synchronous communication results in higher possibletransfer rates.

FIG. 3 is a block diagram illustrating a conventional SDRAM system 300.In system 300, the memory controller includes a plurality of clockedbuffers 304 and the SDRAM includes a plurality of clocked buffers 306.Data from control line 310 and an address bus 312 are received by afinite state machine 308 in the SDRAM. The output of the finite statemachine 308 and the address data are sent to memory array 302 toinitiate a data transfer operation.

FIG. 4 is a timing diagram that illustrates the signals generated insystem 300 during a read operation. At time T0 the memory controllerplaces a read request on line 310 and an address on bus 312. At time T1the SDRAM reads the information on lines 310 and 312. Between T1 and T2the SDRAM retrieves the data located at the specified address frommemory array 302. At time T2 the SDRAM places data from the specifiedaddress on data bus 314. At time T3 the memory controller reads the dataoff the data bus 314.

Because system 300 is synchronous, various issues arise that do notarise in asynchronous systems. Specifically, the synchronous system hasnumerous pipeline stages. Unbalanced pipeline stages waste computationaltime. For example, if a shorter pipeline stage is fed by a longerpipeline stage, there will be some period of time in which the shorterpipeline stage remains idle after finishing its operation and beforereceiving the next set of data from the preceding pipeline stage.Similarly, if a short pipeline stage feeds a longer pipeline stage, theshorter pipeline stage must wait until the longer pipeline stage hascompleted before feeding the longer pipeline stage with new input.

Each stage in the pipeline must allow for the setup, clock transition,and clock-to-output time of the flip-flop that is dividing the stages.Typically the execution time of each step is not substantially largerthan the sum of these overheads, so the latency is significantlyincreased by them. Further, the memory controller may be running from aclock of a different frequency and/or phase from the DRAM subsystemclock. Crossing the boundaries between these clocks requires a timeproportional to the clock frequencies. In addition, the architecturemust take into account jitter that occurs when various data queues areclocked.

In general, the synchronous nature of the SDRAM architecture givesSDRAMs higher transfer rates than EDO DRAMs. However, the higher ratesare achieved at the expense of increased latency and power consumption.Specifically, the time required to clock control and address datathrough various pipeline stages increases the delay between when anaddress for a read operation is transmitted and when the data from thespecified address is actually supplied by the SDRAM.

The increased overhead (OV) that results from the use of synchronoustransfer rather than an asynchronous transfer can be expressed by theformula OV=SD+(T_(DC−D)1)+(T_(DC)−D3)+(T_(DC)−(D2 MOD TDC)), SD issynchronization delay, T_(DC) is the time period of the DRAM clock, D₁is the delay due to controller-to-DRAM time of flight, D₂ is the time toperform a CAS operation, D₃ is the delay due to DRAM-to-controller timeof flight, and (D₂ MOD T_(DC)) is the remainder of (D₂/T_(DC)). SD istypically equal to (T_(DC)+T_(CC)), where T_(CC) is the duration of thecontroller clock cycle. In a system in which the external clock is at 66Mhz and the DRAM subsystem clock is at 83 Mhz, typical values may be:T_(DC) is 12 ns, TCC is 15 ns, D₁ is 6 ns, D₂ is 35 ns, and D₃ is 6 ns.Thus, a typical OV would be (15+12)+(12−6)+(12−6)+(12−11)=40 ns.

Further, systems that use SDRAMs typically consume more power than thesystems that use EDO DRAMs because, when the clock is enabled, the SDRAMinterface is clocked whether or not a data transfer operation isactually being performed. For example, under typical conditions SDRAMsin an idle state consume approximately two to ten times more energy thanEDO DRAMs in an idle state. When the clock is disabled, the clock mustbe enabled before a data transfer operation can be performed. Morespecifically, the clock must be enabled before any address or controlinformation can be sampled by the SDRAM. The time used to enable theclock signal further increases the delay between the time that data isdesired and the time that the requested data is available.

SUMMARY AND OBJECTS OF THE INVENTION

One object of the invention is to provide a memory system with animproved balance between request-to-data latency, power consumption andbandwidth.

According to one aspect of the invention, a memory interface is providedthat maintains the high-bandwidth of synchronous systems, while reducingthe latency and power requirements of these systems. This isaccomplished by using an asynchronous interface for the address andcontrol information, and using a synchronous interface for fast datatransport.

According to one aspect of the invention, a controller transmits controlsignals requesting a data transfer to a memory device. The memory deviceasynchronously receives the control signals and synchronously performsthe requested data transfer.

The memory device has a first mode in which data transfer circuitswithin the memory device are not driven by an internal clock signal. Thememory device has a second mode in which data transfer circuits withinthe memory device are driven by the internal clock signal.

The memory device asynchronously receives the control signals. If thememory device is in the first mode, the memory device may assume thesecond mode in response to one or more of the control signals from amemory controller. While in the second mode, the memory device transfersdata with the data transfer circuits while the data transfer circuitsare being driven by the internal clock signal. The memory device is alsoable to asynchronously perform data transfers while the memory device isin the first mode.

The internal clock signal is generated from an external clock signalthat may selectively pass through a delay lock loop within the memorydevice. The memory device may support higher clock frequencies when theexternal clock signal passes through the delay lock loop to drive thedata transfer circuits during a data transfer. Energy may be saved bycircumventing the delay lock loop and using an external clock signalwith a relatively slower frequency to drive the data transfer circuitsduring a data transfer.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 is a block diagram illustrating a prior art EDO DRAM system;

FIG. 2 is a timing diagram illustrating the timing of signals when aread operation is performed in the EDO DRAM system of FIG. 1;

FIG. 3 is a block diagram illustrating a prior art SDRAM system;

FIG. 4 is a timing diagram illustrating the timing of signals when aread operation is performed in the SDRAM system of FIG. 3;

FIG. 5 a is a block diagram illustrating a memory system according to anembodiment of the present invention;

FIG. 5 b is a block diagram illustrating the clock generation circuitryof FIG. 5 a in greater detail;

FIG. 6 is a timing diagram illustrating the timing of signals when aread operation is performed in the memory system of FIG. 5 a;

FIG. 7 is a timing diagram illustrating the timing of signals when awrite operation is performed in the memory system of FIG. 5 a;

FIG. 8 is a flow chart illustrating the steps performed by a DRAM duringa data transfer in the memory system shown in FIG. 5 a;

FIG. 9 is a timing diagram illustrating the timing of signals during aread transaction in a memory system in which the mask and addresssignals are multiplexed over the same set of lines;

FIG. 10 is a timing diagram illustrating the timing of signals during aread transaction in a memory system in which the mask, address and datasignals are multiplexed over the same lines;

FIG. 11 is a timing diagram illustrating the timing of signals during awrite transaction in a memory system in which the mask, address and datasignals are multiplexed over the same lines;

FIG. 12 is a diagram illustrating the correlation between a RAS signaland separate PRECHARGE and SENSE signals according to an embodiment ofthe invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 5 a, it illustrates a memory system 500 according toone embodiment of the invention. System 500 includes a memory controller518 coupled to a DRAM 520 by a plurality of lines. The lines connectingmemory controller 518 to DRAM 520 include a RAS line 502, an address bus504, a CAS line 506, a mask bus 508, a data bus 510, a clock line 512, aclock enable ( CKE) line 514, and a write enable ( WE) line 516.

The DRAM 520 has a core 522 that includes a memory array 524, a senseamplifier array 560, column I/O circuits 562, a row decoder 526 and acolumn decoder 528. DRAM 520 further includes core timing chains 530,latches 532 and 534, a clocked buffer 536, a finite state machine 538, aflip flop circuit 540 and a clock buffer 544. DRAM 520 further includesa clock generation circuit (CGC) 570 and a mode control circuit 566. Asshall be explained in greater detail below, in system 500, datatransfers are requested using asynchronous communication, while theactual data transfers performed in response to the requests may beperformed using synchronous communication or asynchronous communication,depending on the mode selected by mode control circuit 566.

DRAM 520 illustrates an embodiment that supports at least three datatransfer modes: synchronous mode, slow synchronous mode, andasynchronous mode. As shall be described in greater detail hereafter,mode control circuit 566 controls the transfer mode currently in effectin DRAM 520. Mode control circuit 566 may be, for example, a valuestored in a register of DRAM 520, or pin coupled to an external controlline.

Asynchronous Transfer Control Signals

Referring to FIG. 6, it illustrates the timing of signals generatedduring an exemplary read transaction performed in memory system 500.Initially, the CKE line 514 is HIGH, causing the flip flop 540 to turnoff the clock buffer 544. When the clock buffer 544 is off, any clocksignal on line 512 is prevented from driving the synchronous componentsof DRAM 520.

Prior to time T1, memory controller 518 transmits a row address over theaddress bus 504. The row address is loaded into latches 532 and 534. Attime T1, memory controller 518 causes the RAS signal to go LOW. When theRAS line goes LOW, the row address passes through latch 532 and isapplied to row decoder 526. For multi-bank devices, row and columnaddresses include bank address information. Row decoder 526 causes asense operation to be performed on cells within memory array 524 to loadinto sense amplifier array 560 the data that corresponds to thespecified row address.

Prior to time T3, the memory controller 518 places a column address onthe address bus 504. The column address is loaded into latches 532 and534. At time T3, the memory controller 518 causes the signal on the CASline 506 to go LOW. When the CAS signal goes LOW, the column addresspasses through latch 534 and is applied to column decoder 528. Columndecoder 528 causes an access operation to be performed on the datacurrently stored in the sense amplifier array 560. The datacorresponding to the specified column address is sent from senseamplifier array 560 through column I/O circuits 562.

Prior to time T6, the memory controller 518 places a second columnaddress on the address bus 504. The column address is loaded intolatches 532 and 534. At time T6, the memory controller 518 causes thesignal on the CAS line 506 to go LOW. When the CAS signal goes LOW, thecolumn address passes through latch 534 and is applied to column decoder528. Column decoder 528 causes an access operation to be performed onthe data currently stored in the sense amplifier array 560. The datacorresponding to the specified column address is sent from senseamplifier array 560 through column I/O circuits 562.

Significantly, all of the control information to perform the readtransaction is sent without reference to any particular clock cycles.This is true even though the internal clock of DRAM 520 may be active atthe time at which some of the control signals are sent by the memorycontroller 518. For example, the internal clock is active at time T6when the second column address is latched to the column decoder.However, the timing of the CAS signal that causes the column address tobe latched and sent to the column decoder does not necessarily have anycorrelation with the clock signal.

According to an alternate embodiment, the RAS and CAS signals are wellcontrolled with respect to the clock signal on line 512. In such anembodiment, the request for data is issued from the same time domain asthe data transport clock on line 512. The timing of the data transfermay then be determined based on the timing of the control signals.

For example, data transport may begin a predetermined number of clockcycles after the clock cycle on which the falling edge of CAS occurs.Various techniques may be used to ensure that the DRAM is aware of theclock cycle on which the falling edge of CAS occurred. For example, thememory controller 518 may cause the CKE signal to go LOW sufficientlybefore the falling edge of CAS to ensure that the internal clock signalis stabilized by the time the falling edge of CAS occurs.

Alternately, if it has been determined exactly how many clock cycleswill elapse between the falling edge of CKE and the first clock cycle tocause data to be output, the falling edge of CKE may be used to time thedata transfer. Under these circumstances, the internal clock signal mustbe relatively stable as soon as clock buffer 544 is activated inresponse to the falling edge of CKE.

In an alternate embodiment, DRAM 520 includes address transition detectcircuitry, thus avoiding the need of separate CAS line 506 and signal.Address transition detect circuitry monitors the address bus 504 todetect transitions in the data that is being sent on the address bus504. When a transition is detected, DRAM 520 restarts the timing chains530 causing data corresponding to a new address to fall out of thecolumn I/O circuits 562.

Multi-Mode Clock Generation Circuit

As mentioned above, DRAM 520 supports a synchronous data transfer mode,a slow synchronous data transfer mode, and an asynchronous data transfermode. The current data transfer mode determines the signal at the outputof clock generation circuit 570. The mode is selected by mode controlcircuit 566, which may be, for example, a value in a register withinDRAM 520 or a pin connected to an external control line.

Referring to FIG. 5 b, it is a block diagram illustrating a clockgeneration circuit 570 according to one embodiment of the invention.Clock generation circuit 570 includes a multiplexer 574 with threeinputs and one output. The inputs are coupled to lines 564, 576 and 512.The output of multiplexer 574 feeds the input of clock buffer 544. Themultiplexer 574 is controlled by the control signal sent by the modecontrol circuit 566 over line 568.

When mode control circuit 566 applies a signal associated with theasynchronous transfer mode over line 568, the signal on CAS line 506passes from line 564 through multiplexer 574 to the input of clockbuffer 544. When mode control circuit 566 applies a signal associatedwith the synchronous transfer mode over line 568, the output of a delaylock loop (DLL) 572 whose input is the external clock signal on line 512passes through multiplexer 574 to the input of clock buffer 544. Whenmode control circuit 566 applies a signal associated with the slowsynchronous transfer mode over line 568, the external clock signal online 512 passes through multiplexer 574 to the input of clock buffer544.

Clock Activation

Returning again to the transaction illustrated in FIG. 6, the memorycontroller 518 causes the signal on the CKE line 514 to go LOW at timeT2. When the CKE line 514 goes LOW, the flip flop 540 turns on the clockbuffer 544. The signal at the output of clock generation circuit 570begins driving clocked buffer 536 and finite state machine 538 throughthe clock buffer 544 when the clock buffer 544 is on. Assuming that DRAM520 is in either synchronous mode or slow synchronous mode, the signalat the output of clock generation circuit 570 will reflect a clocksignal on line 512, as shown in FIG. 6.

In FIG. 6, the “internal clock signal” is the signal generated at theoutput of the clock buffer 544. The internal clock signal generated byclock buffer 544 typically takes a few cycles to stabilize. Therefore,the signal on line 546 does not immediately reflect the clock signal online 512. In the illustrated example, the signal on line 546 does notstabilize until some time has elapsed after T2.

In the illustrated read transaction, the source of the clock signal online 512 is not activated until time T2. By turning off the source ofthe external clock signal when no data transfers are in progress, boththe external clock source and DRAM 520 conserve power when data transferoperations are not being performed. In alternative embodiments, thesource of the external clock signal on line 512 remains on, while theinternal clock signal on line 546 is only turned on when DRAM 520 isactually involved in a data transfer, as described above.

Synchronizing the Timing

After time T3, the DRAM 520 has all the information it requires totransmit data from the specified row and column, but does not yet knowwhen to begin sending the data. In conventional SDRAMs, the timing ofthe data transfer is based on the timing of the data transfer request.Thus, if a controller sends a data transfer request on a particularclock cycle, then the controller knows that the requested data transferwill begin a predetermined number of clock cycles after the particularclock cycle.

In system 500, the data transfer requests are transmitted in anasynchronous manner. In fact, the clock source whose signal is used totime synchronous data transfers may not even be active at the time theRAS and CAS signals are transmitted. Therefore, the transmission ofinformation other than the data itself (e.g. CAS, RAS , addressinformation, WE, etc.) need not be associated with any particular clockcycle or mode. Consequently, DRAM 520 cannot time the transmission ofdata based on a clock cycle on which the RAS or CAS signals weretransmitted, and memory controller 518 cannot use a clock cycle on whichthe RAS or CAS signals were transmitted to determine the clock cycle onwhich DRAM 520 will begin sending data.

According to one embodiment of the invention, the rising edge of the CKEsignal is used as a timing mark to indicate to the finite state machine538 of DRAM 520 when to begin sending requested data. Specifically, theclock buffer 544 is activated at the falling edge of the CKE signal (attime T2) as described above. The memory controller 518 continues togenerate the LOW CKE signal. After the clock signal from the clockbuffer has stabilized, the memory controller 518 causes the CKE signalto go HIGH. The time at which the CKE signal goes HIGH is used by memorycontroller 518 and the finite state machine 538 as a timing mark.

According to an alternate embodiment, a control line separate from theCKE line 514 may be used to provide the timing mark. In an embodimentthat uses a separate control line for the timing mark, CKE might be fullswing CMOS while the timing mark is low swing high speed signal.

In the illustrated read transaction, the first timing mark occurs attime T4. In one embodiment, the finite state machine 538 begins thetransmission of the requested data a predetermined number of clockcycles after the timing mark, and memory controller 518 knows to expectthe data from DRAM 520 the predetermined number of clock cycles afterthe timing mark. The predetermined number may be a fixed constant, or avalue stored in a register within DRAM 520.

In the illustrated embodiment, the WE signal is sampled at the firstrising edge of the clock signal after CKE is sampled HIGH. The sample ofWE is used to determine whether the transaction is going to be a readtransaction or a write transaction. In the example shown in FIG. 6, WEis HIGH on the first rising edge of the clock signal after CKE goesHIGH, indicating that the data transfer is going to be a readtransaction.

In an alternate embodiment, the WE signal can be sampled at the fallingedge of CKE. To increase transmission bandwidth, the input receive pathof DRAM 520 and the output transmit path of DRAM 520 can be separatelycompensated. For example, clock generation circuit 570 and clock buffer544 may be replaced with two clock generation circuit/clock buffercombinations, where one clock generation circuit/clock buffercombination is used to drive clocked buffer 536 to receive data and adifferent clock generation circuit/clock buffer combination is used todrive clocked buffer 536 to transmit data. Power is saved by activatingonly the clock generation circuit/clock buffer combination that will beinvolved in the transfer. By sampling the WE signal at the falling edgeof CKE, the DRAM has more time between when the type of transaction(read or write) is known and when the data transfer will begin. Duringthis interval the DRAM activates the clock buffer that corresponds tothe type of transaction to be performed.

The Synchronous Data Transfer

As mentioned above, the finite state machine 538 causes data from thespecified column of the specified row to be sent over the data bus 510 apredetermined number of clock cycles after the timing mark. The delaybetween a CAS signal and the transmission of data must be long enoughfor the data from the appropriate column to be loaded through the columnI/O circuits 562 into the clocked buffer 536. In the illustratedexample, each column address corresponds to eight bytes. However, apacket size of eight bytes is merely exemplary. The actual size of datapackets will vary from implementation to implementation. The presentinvention is not limited to any particular size of data packet.

In response to the CAS signal, eight bytes that correspond to thespecified column address are loaded through the column I/O circuits 562into clocked buffer 536. During a data transfer, finite state machine538 causes the eight bytes to be sent sequentially (per data bus width)from the clocked buffer 536 to the data bus 510. The clock signal fromthe clock buffer 544 determines the timing of the transmission of theeight bytes. In the illustrated example, two bytes are sent per clockcycle, beginning a time T5. The same clock signal is applied to aclocked buffer 550 in the memory controller 518. The eight bytes of dataare sequentially received at the clocked buffer 550 based on the timingof the clock signal.

In the embodiment described above, data is transferred through columnI/O circuits 562 to clocked buffer 536 eight bytes at a time, andtransferred out of clocked buffer 536 to clocked buffer 550 one byte ata time. Consequently, in this embodiment, clocked buffer 536 may be aparallel to serial shift register, while clocked buffer 550 may be aserial to parallel shift register. The buffer circuits used to performthe transfer function may vary from implementation to implementation.The present invention is not limited to any particular type of clockedbuffers, nor any particular clock speeds or bandwidths used to transferdata within DRAM 520 or between DRAM 520 and memory controller 518.

Shutdown after a Data Transfer

As mentioned above, the synchronous components within DRAM 520 begin tobe driven at time T2 by the clock signal on line 512. While thesecomponents are being driven by the clock signal, the DRAM 520 continuesto consume relatively large amounts of power. DRAM 520 would continue toconsume large amounts of power even when DRAM 520 is not involved in adata transfer if the DRAM 520 is not isolated from the clock signal online 512 after the completion of a data transfer. Therefore, finitestate machine 538 contains a mechanism for turning off clock buffer 544after all of the outstanding data transfer operations that involve DRAM520 have been completed.

According to one embodiment of the invention, finite state machine 538uses a countdown timer to determine when to turn off the clock buffer544. Specifically, upon detecting the timing mark, finite state machine538 stores a count value in a countdown timer and begins decrementingthe count value during each clock cycle. As shall be explained ingreater detail below, the countdown timer is incremented or reloaded foreach data block in multiple-block transfers. When count value of thecountdown timer reaches zero, the finite state machine 538 sends asignal to flip flop 540 over a line 542 to cause the flip flop 540 toturn off the clock buffer 544. When clock buffer 544 is turned off, thesynchronous components of DRAM 520 cease to be driven by the clocksignal on line 512, causing DRAM 520 to assume a state in which littlepower is consumed.

Alternative embodiments may use other mechanisms for turning off theclock buffer 544 when all data transfers involving the DRAM 520 havebeen completed. For example, logic circuits within finite state machine538 may be configured to detect the completion of a data transferoperation and determine whether there is any outstanding transactionthat involves DRAM 520. If there is an outstanding transaction, then thefinite state machine 538 transmits the appropriate signals to theclocked buffer 536 to perform the outstanding transaction. If there areno outstanding transactions that involve DRAM 520, then the finite statemachine 538 sends a signal to the flip flop 540 to cause the clockbuffer 544 to be turned off.

Asynchronous Data Transfer Mode

To achieve high data transfer rates, synchronous transfers can beperformed as described above. However, under certain conditions it maybe desirable to avoid the relatively high power consumption requirementsof DLL 572 by performing data transfers asynchronously.

To perform asynchronous data transfers, mode control circuit 566 appliesa control signal to line 568 to cause the signal on CAS line 506 to begenerated at the output of clock generation circuit 570, as describedabove. Memory controller 518 may then toggle the CAS signal withoutintroducing any new address information on address bus 504, causing theCAS signal to act as a clock to drive clocked buffer 536.

In an alternate embodiment, asynchronous transfers may be performed byplacing the clocked buffer 536 in flow-through. To address the widthmismatch between the internal data bus 523 and the external data bus510, the memory controller 518 presents sufficient addressinginformation to the DRAM 520 to select a single byte from the eight bytesloaded on the sense amplifier array 560.

Slow Synchronous Data Transfer Mode

Even when synchronous data transfers are desired, the delay lock loopcircuit 572 within clock generation circuit 570 may be bypassed toreduce power consumption. To bypass DLL 572, mode control circuit 566applies a control signal to line 568 to cause the signal on line 512 tobe generated at the output of clock generation circuit 570, as describedabove.

However, DRAM 520 cannot support the same transfer rate without theclock synchronization provided by the DLL 572 as it can with a clocksynchronized by the DLL 572. Consequently, when the DLL 572 is bypassed,a slower clock signal must be used to perform the synchronous datatransfers. Due to the lower clock frequency, the synchronous datatransfers take longer than when the DLL 572 is used. Consequently, DRAM520 is said to be in “slow” synchronous data transfer mode when anexternal clock signal that has not been phase compensated by a DLL isused to drive the data transfers.

Multiple-Block Transfers

In an embodiment that uses a countdown timer, the seed count value usedby the countdown timer is based on the amount of time required for DRAM520 to send one packet of data (eight bytes in the illustrated example).Specifically, after the timing mark is detected, the clock buffer 544must stay on long enough for a packet of data to be accessed, loaded,and transmitted from DRAM 520. If a new column address arrives beforedata from the previous column address has been completely transferred,then the clock buffer 544 should stay on until the data from the newcolumn address has been transmitted.

To prevent clock buffer 544 from being turned off between consecutivepacket transfers, the finite state machine 538 adds a predeterminedvalue to the count value in the countdown timer upon detecting a fallingedge of the CKE signal. Because the count value in the countdown timeris increased, a greater number of clock cycles will elapse before thecount value reaches zero. Preferably, the predetermined value that isadded to the count value causes the shutdown of the clock buffer 544 tobe delayed long enough for the additional packet of data to betransferred.

In an alternate embodiment, a predetermined value is loaded into thecountdown timer upon detecting a falling edge of the CKE signal. Thepredetermined value is large enough to ensure that the countdown timerwill not reach zero before a packet of data is transferred. During thetransfer of multiple data packets the counter will repeatedly bereloaded and thus never reach zero.

FIG. 6 illustrates the timing of a read transaction in which two datapackets are transferred. At time T2 the count value in the countdowntimer is set to a value that ensures that the clock buffer 544 will beon long enough for one packet of data to be transferred. In theillustrated example, the count value will be set to a value that ensuresthat the clock buffer 544 remains on until time T8.

At time T5, the finite state machine 538 adds or reloads a predeterminednumber to the count value in response to detecting the falling edge ofthe CKE signal. At time T8 the transmission of the first packet of datais completed. Because the predetermined value was added to the countvalue or the counter was reloaded, the finite state machine 538 does notturn off the clock buffer at T8. Rather, the count value does not reachzero until after time T9, when the packet of data from the second columnhas been completely transferred.

According to an alternate embodiment of the invention, finite statemachine 538 contains logic for keeping track of how many CAS requestsremain to be serviced. Upon detecting the falling edge of the CKEsignal, the finite state machine 538 increments the outstanding requestvalue. Upon completing the transfer of one data block, the finite statemachine 538 decrements the outstanding request value. When theoutstanding request value is zero, the finite state machine 538 turnsoff the clock buffer 544.

Write Transaction Timing

FIG. 7 is a timing diagram of the signals generated in system 500 duringa two packet write transaction. At time T1, an address on address bus504 is transferred from latch 532 to row decoder 526 when the RAS signalon line 502 goes LOW. At time T2, the CKE signal on line 514 goes LOWcausing the flip flop 540 to activate the clock buffer 544. The finitestate machine 538 detects the rising edge of the CKE signal to determinethat time T3 (the rising edge of the CKE signal) is the timing mark forthe first packet transfer.

The WE signal is sampled on the first clock cycle after the rising edgeof the CKE signal to determine whether the transaction is going to be aread transaction or a write transaction. In the present example, WE isLOW at the rising edge of the first clock cycle after the CKE signalgoes HIGH, indicating that the data transfer is going to be a writetransaction.

At time T4, CAS goes LOW indicating to DRAM 520 that the data bus 510has data that is to be written to the column that corresponds to theaddress on the address bus 504. In the illustrated example, the addresson the address bus at time T4 specifies column A. The DRAM also receivesthe mask data on lines 508. The finite state machine 538 controls theclocked buffer 536 to cause the data to be synchronously stored incolumn A in the sense amplifier array 560. Finite state machine 538knows to expect the data at time T5 because time T5 is a predeterminednumber of clock cycles (e.g. one clock cycle) after the timing mark.

A timing mark occurs at time T6, the first clock cycle after anotherrising edge of the CKE signal. At time T6 the WE signal is sampled. Inthe illustrated example, the WE signal is LOW at time T6 indicating asecond column of data is to be written to DRAM 520. When receipt of thefirst packet of data is complete, the received data is stored in columnA of the appropriate row of the memory array 524.

At time T7, CAS goes LOW, indicating to DRAM 520 that the data bus 510has data that is to be written to the column that correspond to theaddress on the address bus 504. In the illustrated example, the addresson the address bus 504 at time T7 specifies column B. The finite statemachine 538 controls the clocked buffer 536 to cause the data to besynchronously received into column B of the sense amplifier array 560.Finite state machine 538 knows to expect the data at time T7 becausetime T7 is a predetermined number of clock cycles after the secondtiming mark at time T6. At time T8 the second packet of data has beencompletely received, so the DRAM 520 stores the second packet of data incolumn B of the appropriate row within memory array 524.

FIG. 8 is a flowchart illustrating the operation of system 500 accordingto an embodiment of the invention. Initially, DRAM 520 is in a powereddown state where clock buffer 544 is off. At step 800, the DRAM 520detects the fall of the RAS signal. The fall of the RAS signal causesthe address on the address bus 504 to be sampled (i.e. sent from latch532 to row decoder 526) at step 802. At step 804 the core of DRAM 420senses the row of data that corresponds to the address sampled at step802.

At step 812, the DRAM 520 detects the falling edge of the CAS signal. Inresponse to detecting the falling edge of the CAS signal, DRAM 520samples the mask signals on lines 508 and the column address on theaddress bus 504 (step 814).

Steps 800, 802, 804, 812 and 814 are performed asynchronously andtherefore do not require an active clock signal. Steps 806, 808 and 810may occur before, in parallel with, or after steps 800, 802, 804, 812and 814, and therefore are shown as a separate thread of execution.

At step 806, the CKE signal goes LOW causing the clock buffer to beturned on at step 808. At step 810 the DRAM 520 detects a timing mark.In the embodiment described above, the timing mark is detected when thefinite state machine 538 senses the start of the first clock cyclesubsequent to the rising edge of the CKE signal. The WE signal issampled at this time to determine whether the data transfer is going tobe a read transaction or a write transaction.

At step 816, the finite state machine 538 determines the clock cycle onwhich the data transfer is to begin based on when the timing mark wasdetected and whether the transaction is a write transaction or a readtransaction.

At step 818, it is determined whether the WE signal sampled at step 810indicated that the transaction is a write transaction. The WE signalsampled at step 810 indicated that the transaction is a writetransaction, then control proceeds to step 828. Otherwise, controlproceeds to step 820.

Significantly, all of the steps performed up to step 816 are performedin an asynchronous manner. The use of an asynchronous mechanism toperform these steps reduces the latency between the fall of the RASsignal and the time that the appropriate row of data is sensed. By thetime step 810 has been performed, the clock buffer 544 has been on longenough to provide a stable clock signal that may be used tosynchronously transfer the data involved in the transaction.

At step 820 the core of DRAM 520 loads into an output buffer (e.g.clocked buffer 536) the data block from the column specified in theaddress sampled at step 814. At step 822 the data block is transmittedfrom the output buffer to the memory controller 518 in a synchronousfashion based on the clock signal from clock buffer 544. At step 824 itis determined if the CAS signal went LOW again. If so, then anadditional packet of data is to be sent in the current read transaction.Control therefore returns to steps 810 and 814. If the CAS signal didnot go LOW again, then the last packet of data for the transaction hasbeen transmitted, and the clock buffer 544 is turned off at step 826.

Control proceeds to step 828 if the transaction is a write transaction.At step 828, DRAM 520 receives data through clocked buffer 536 which isdriven by the clock signal from clock buffer 544. When the packet ofdata has been received, the packet of data is stored in the memory array524 of DRAM 520 at step 830. At step 824 it is determined if the CASsignal went LOW again subsequent to steps 810 and 812. If so, then anadditional packet of data is to be received in the current writetransaction. Due to the asynchronous control circuitry of DRAM 520, theclock does not have to be operating to perform a memory cell refreshoperation. Control therefore returns to step 814. If the CAS signal didnot go LOW subsequent to step 812, then the last packet of data for thetransaction has been received, and the clock buffer 544 is turned off atstep 826.

It should be noted that an assertion of RAS may be followed by anyarbitrary read/write sequence. For example, RAS may go LOW to cause aparticular row of data to be loaded into sense amplifier array 560.Subsequently, a series of mixed reads and writes may be performed on therow of data. In addition, an arbitrary amount of time may elapse betweenCAS signals. The duration of RAS and the delay between CAS operations islimited only by core considerations such as refresh rates.

Multiple-DRAM Systems

The memory system 500 of FIG. 5 a includes only one DRAM 520. However,the present invention is not limited to memory systems with anyparticular number of DRAMs. Additional DRAMs may be added to memorysystem 500 without affecting the operations described above. Each of theDRAMs would be connected to memory controller 518 by its own private CASline, RAS line and CKE line. All of the other lines that connect theDRAMs to the memory controller 518 may be shared.

In an alternate embodiment, a memory system has a two dimensional arrayof memory chips. In such an embodiment, all DRAMs that belong to thesame column of the two dimensional array would share the same set ofcontrol lines, while each row of DRAMs in the two dimensional arraywould have its own set of control lines.

Multiplexed Embodiments

In the embodiment illustrated in FIG. 5 a, the throughput is maximizedby providing separate lines for each type of signal so that the signalswhich are separated can function simultaneously. However, as a generalrule, the higher the number of lines required by a memory system, themore expensive it is to manufacture the components for the memorysystem. Therefore, the approach shown in FIG. 5 a may not be optimalwhen the cost of manufacturing is taken into account. In an alternativeembodiment to that shown in FIG. 5 a, the number of lines is reduced bymultiplexing some of the lines to allow the same lines to carry morethan one type of signal.

According to an alternative embodiment, the mask signal can be sent overthe address bus 504, eliminating the need for mask lines 508. FIG. 9 isa timing diagram illustrating the timing of the signals generated duringa write operation in such an embodiment. The timing proceeds in the samefashion as described above with reference to FIG. 7 with the differencethat the mask signal is not sent over a mask bus at the same time as thecolumn address is sent over the address bus. Rather, both the addressand the mask bits are sent over a combined address/mask bus, where theaddress bits precede the corresponding mask bits.

Similar to memory system 500, the memory controller in a combinedaddress/mask bus embodiment indicates to the DRAM that the columnaddress is present on the address/mask bus by causing the CAS signal togo LOW (at times T1 and T4). The memory controller indicates to the DRAMthat the transaction is a write transaction by causing the WE signal tobe LOW at the start of the clock cycle after the rising edge of the CKEsignal. In addition, the memory controller indicates the presence of themask bits on the address/mask bus (at times T2 and T5) by causing theCAS signal to go HIGH. When the DRAM detects the rising edge of the CASsignal, the DRAM reads the mask bits from the address/mask bus.

In an alternate combined address/mask bus embodiment, the memorycontroller indicates the presence of the mask bits on the address/maskbus by causing the WE signal to go HIGH. When the DRAM detects therising edge of the WE signal, the DRAM reads the mask bits from theaddress/mask bus. When the rising edge of WE is used to indicate thepresence of mask bits, the mask bits for the transfer of a particulardata block must be placed on the combined address/mask bus at the risingedge of WE that corresponds to the transfer of the particular datablock. In FIG. 9, for example, the mask bits associated with the datablock that is transferred beginning at T1 would be placed on thecombined address/mask bus to be read at the first rising edge of WEafter time T0. Similarly, the mask bits associated with the data blockthat is transferred beginning at T4 would be placed on the combinedaddress/mask bus to be read at the first rising edge of WE after timeT3.

For read transactions, mask bits are not transmitted. Therefore, readtransactions in a combined address/mask bus embodiment proceed asillustrated in FIG. 6, with the exception that the separate mask signaldoes not exist.

In alternative embodiments, addresses may be multiplexed even though aseparate address bus is provided. For example, row addresses may be sentover the separate address bus while column addresses are multiplexed onthe same bus that carries data. Similarly, column addresses may be sentover the separate address bus while row addresses are multiplexed on thesame bus that carries the data.

Read Transaction in a Multiplexed Data/Address/Mask Bits Embodiment

The number of lines required by a memory system that implements thepresent invention may be further reduced by using the same set of linesto transmit the data, address and mask bits. FIG. 10 illustrates thetiming of signals generated during a read transaction in an embodimentin which the data, address and mask bits are transmitted over a combinedbus.

Referring to FIG. 10, at time T1 the RAS signal goes LOW to indicate tothe DRAM that a row address is on the combined bus. The DRAM reads therow address and begins a sense operation to load the appropriate row ofdata into the sense amplifier array. At time T2, the CAS signal goes LOWto indicate to the DRAM that a column address is on the combined bus. Inthe illustrated example, the column address on the combined bus at timeT2 specifies column address A. Also at time T2, the signal goes LOW toturn on the clock buffer within the DRAM.

The memory controller causes the CKE signal to go HIGH to indicate thattime T3 is the timing mark for the transfer of data from column addressA. At time T4, the CAS signal goes LOW to indicate to the DRAM that acolumn address is on the combined bus. In the illustrated example, thecolumn address on the combined bus at time T4 specifies column addressB. At time T5, the data from column address A begins to be placed on thecombined bus. The memory controller knows to expect the data from columnaddress A at time T5 because the time at which the data from columnaddress A is placed on the combined bus is determined by the timing markat time T3. Also at time T5, the DRAM core begins to access the datafrom column address B.

The memory controller causes the CKE signal to go HIGH to indicate thatT6 is the timing mark for the transfer of data from column address B. Attime T7, the CAS signal goes LOW to indicate to the DRAM that a columnaddress is on the combined bus. In the illustrated example, the columnaddress on the combined bus at time T7 specifies column address C. Attime T8, the data from column address B begins to be placed on thecombined bus. The memory controller knows to expect the data from columnaddress B at time T8 because the time at which the data from columnaddress B is placed on the combined bus is determined by the timing markat time T6. Also at time T8, the DRAM core begins to access the datafrom column address C. This process may be repeated to transfer anyarbitrary number of columns of data. Each falling edge in the CAS signalinitiates a transfer that constitutes an independent transaction, andcontinues until the entire set of read and write transactions have beencompleted.

Write Transaction in a Multiplexed Data/Address/Mask Bits Embodiment

FIG. 11 illustrates the timing of signals generated during a writetransaction in an embodiment in which the data, address and mask bitsare transmitted over a combined bus. Referring to FIG. 11, at time T1the RAS signal goes LOW to indicate to the DRAM that a row address is onthe combined bus. The row decoder receives the row address and begins asense operation to load the appropriate row of data into the senseamplifier array. At time T2, the CKE signal goes LOW to turn on theclock buffer within the DRAM.

The memory controller causes the CKE signal to go HIGH prior to time T3to indicate that T3 is the timing mark. At time T3 the DRAM samples theWE signal to determine that the transaction is a write transaction. TheDRAM receives a column address specifying column A when CAS goes LOW,and mask data when CAS goes HIGH. The transfer of data for column Abegins at time T4. The DRAM knows to receive the data for column A attime T4 because clock cycle T4 is a predetermined number of clock cyclesafter the timing mark (T3). In the illustrated example, data istransmitted three clock cycles after the corresponding timing mark.

The second rising edge of the CKE signal indicates to the DRAM that timeT5 is a timing mark for a second data transfer operation. The DRAMsamples the WE signal at time T5 to determine that the second datatransfer transaction will be a write transaction.

Independent Sense and Precharge Signals

When a single RAS line is connected to a DRAM, only one bank within theDRAM may be sensed at any given time. Therefore, only one senseamplifier array is required per DRAM. To allow more than one bank to besensed at a time, multiple RAS lines can be connected to the DRAM. Ifeach bank within the DRAM has its own RAS line, then the controller canindependently control (and sense) each of the banks. In such anembodiment, each bank would have its own sense amplifier array. However,the cost of providing a separate line for each bank in each DRAM issignificant.

To avoid the cost of providing a separate RAS line for each back in eachDRAM, the RAS line may be replaced with separate SENSE and PRECHARGEsignals. In this embodiment, the memory controller can cause a rowwithin any given bank to be sensed by causing the SENSE signal to go LOWwhile placing an address on the address bus that indicates a particularrow and bank within the DRAM. The rising edge of SENSE is irrelevant,though a minimum pulse width must be observed. Similarly, any bank maybe precharged by causing the PRECHARGE signal to go HIGH while placingan address on the address bus that indicates a particular bank withinthe DRAM. The falling edge of the PRECHARGE signal is irrelevant. FIG.12 illustrates the correlation between separate SENSE and PRECHARGEsignals and a traditional RAS signal. In this embodiment, each bank willhave its own sense amplifier array, but will not require its own RASline.

In a system that provides separate PRECHARGE and SENSE signals, theaddress that is sent when the CAS signal goes LOW includes, in additionto a column address, bits that indicate a particular memory bank. TheDRAM transmits data from the specified column of the sense amplifierarray that corresponds to the specified memory bank. Thus, in the readtransaction described above with reference to FIG. 10, column address A,column address B and column address C may be columns in different memorybanks.

In the foregoing specification, the invention has been described withreference to specific embodiments thereof. It will, however, be evidentthat various modifications and changes may be made thereto withoutdeparting from the broader spirit and scope of the invention. Thespecification and drawings are, accordingly, to be regarded in anillustrative rather than a restrictive sense.

1. An integrated circuit memory device having an array of memory cells,the memory device comprising: an input to receive a clock enable signal;a clock buffer coupled to the input, the clock buffer responsive to theclock enable signal to output a clock signal; and a register to store avalue that represents a predetermined time for a data transfer to beginafter receipt of the clock enable signal.
 2. The integrated circuitmemory device of claim 1, wherein the predetermined time is apredetermined number of clock cycles of the clock signal.
 3. Theintegrated circuit memory device of claim 1, wherein the integratedcircuit memory device further comprises: a clock generation circuitcoupled to an input of the clock buffer.
 4. The integrated circuitmemory device of claim 3, wherein the clock generation circuit includesa delay lock loop circuit.
 5. The integrated circuit memory device ofclaim 3, wherein the clock generation circuit includes an input toreceive an external clock signal.
 6. The integrated circuit memorydevice of claim 1, wherein the input includes a pin to receive the clockenable signal, wherein a falling edge of the clock enable signal enablesthe clock buffer to receive the external clock signal.
 7. The integratedcircuit memory device of claim 1, wherein the array of memory cellsincludes dynamic memory cells to store data.
 8. The integrated circuitmemory device of claim 7, wherein the array of memory cells includes aplurality of banks of memory cells to store data.
 9. The integratedcircuit memory device of claim 1, wherein the integrated circuit memorydevice further comprises: an output buffer to output data in response tothe internal clock signal.
 10. A method of operation in an integratedcircuit memory device having an array of memory cells, the methodcomprising: generating an internal clock signal, the internal clocksignal provided to a clock buffer; enabling the clock buffer to outputthe internal clock signal; and delaying the beginning of a data transferoperation by a predetermined time after the enabling of the clockbuffer.
 11. The method of claim 10, wherein the predetermined time is apredetermined number of clock cycles of the clock signal.
 12. The methodof claim 10, further comprising: receiving an external clock signal,wherein a clock generation circuit, coupled to an input of the clockbuffer, generates the internal clock signal in response to the externalclock signal.
 13. The method of claim 12, wherein the clock generationcircuit includes a delay lock loop circuit.
 14. The method of claim 12,further comprising: receiving a clock enable signal, wherein a fallingedge of the clock enable signal enables the clock buffer to receive theexternal clock signal.
 15. The method of claim 10, wherein the array ofmemory cells includes dynamic memory cells to store data.
 16. The methodof claim 10, wherein the array of memory cells includes a plurality ofbanks of memory cells to store data.
 17. The method of claim 10, furthercomprising: outputting data, during the data transfer operation, inresponse to the internal clock signal.